Touch sensor, display device including the same, and method of manufacturing touch sensor

ABSTRACT

Disclosed is a touch sensor that includes a support layer including a touch area and a non-touch area surrounding the touch area, a sensing electrode part disposed on the support layer and in the touch area, and an insulating layer disposed in the touch area and a portion of the non-touch area. The insulating layer has a trench disposed along a perimeter of the touch area in the non-touch area. Also disclosed is a display device that includes the touch sensor and a method of manufacturing the touch sensor.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2017-0050664, filed on Apr. 19, 2017, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Exemplary embodiments relate to a touch sensor, a display deviceincluding the same, and a method of manufacturing the touch sensor.

Discussion of the Background

Recently, consumers have shown a heightened interest in informationdisplay. In particular consumers have shown an increase in demand foruse of portable information media (e.g., smart phones). To meet thisdemand, consumer electronics companies continue researching displaydevices to improve them and commercialize newer display devices withimproved features.

Recent display devices include a touch sensor for receiving a touchinput from a user together with an image display function. Accordingly,a user is able to more conveniently use the display device by using thetouch sensor in place of a separate input (e.g., a mouse or a physicalkeyboard).

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventive concept.Therefore, it may contain information that does not form the prior artthat was already known in this country to a person of ordinary skill inthe art or that was publically available prior to an effective filingdate of subject matter disclosed herein.

SUMMARY

Exemplary embodiments provide a touch sensor, in which a defect isdecreased, and a display device including the same.

Exemplary embodiments provide a method of manufacturing a touch sensor,in which a defect is decreased.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concept.

According to exemplary embodiments, a touch sensor includes a supportlayer including a touch area and a non-touch area surrounding the toucharea, a sensing electrode part disposed on the support layer in thetouch area, and an insulating layer in the touch area and a portion ofthe non-touch area. The insulating layer has a trench disposed along aperimeter of the touch area in the non-touch area.

According to other exemplary embodiments, a display device includes adisplay panel and a touch sensor provided on an upper surface of thedisplay panel. The touch sensor includes a support layer including atouch area and a non-touch area surrounding the touch area; a sensingelectrode part disposed on the support layer in the touch area; and aninsulating layer disposed in the touch area and in a portion of thenon-touch area, and the insulating layer has a trench disposed along aperimeter of the touch area in the non-touch area.

According to other exemplary embodiments, a method of manufacturing atouch sensor includes forming a support layer on a carrier substrate;forming a touch electrode pattern on the support layer; forming a touchsensor by forming an insulating layer on the touch electrode pattern;separating the touch sensor from the carrier substrate; and attachingthe touch sensor onto a substrate. The insulating layer may be formed ina touch area and a non-touch area surrounding the touch area, and theinsulating layer may have a trench disposed along a perimeter of thetouch area in the non-touch area.

In the touch sensor according to the exemplary embodiment of the presentdisclosure and the display device adopting the touch sensor, a defect ina sensing electrode part and wires is decreased compared to a displaydevice in the related art.

According to the exemplary embodiment of the present disclosure, it ispossible to provide the method of easily manufacturing a touch sensor,in which a defect is decreased, by a roll-to-roll method.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concept, and, together with thedescription, serve to explain principles of the inventive concept.

FIG. 1 is a perspective view illustrating a display device according toan exemplary embodiment.

FIG. 2 is a top plan view illustrating a touch sensor according to anexemplary embodiment.

FIG. 3A is a cross-sectional view taken along line I-I′ of FIG. 2.

FIG. 3B is a cross-sectional view taken along line II-II′ of FIG. 2.

FIG. 3C is a top plan view of the touch sensor, and illustrates only aninsulating layer.

FIGS. 4A and 4B are top plan views illustrating touch sensors accordingto exemplary embodiments.

FIGS. 5A, 5B, 5C, and 5D are cross-sectional views illustrating touchsensors according to exemplary embodiments.

FIGS. 6A, 6B, 6C, 6D, 6E, 6F, 6G are cross-sectional views sequentiallyillustrating a method of manufacturing a touch sensor according to anexemplary embodiment.

FIG. 7 is a top plan view illustrating the case where the plurality oftouch sensors is simultaneously manufactured according to an exemplaryembodiment.

FIG. 8 is a top plan view illustrating a touch sensor according to anexemplary embodiment.

FIG. 9 is a cross-sectional view of an enlarged portion PI of FIG. 8.

FIG. 10 is a cross-sectional view taken along line of FIG. 9.

FIGS. 11A, 11B, 11C, and 11D are cross-sectional views illustratingdisplay devices according to exemplary embodiments.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

In the accompanying figures, the size and relative sizes of layers,films, panels, regions, etc., may be exaggerated for clarity anddescriptive purposes. Also, like reference numerals denote likeelements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various elements, components, regions, layers, and/or sections,these elements, components, regions, layers, and/or sections should notbe limited by these terms. These terms are used to distinguish oneelement, component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the present disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

Hereinafter, exemplary embodiments will be described in detail in moredetail with reference to the accompanying drawings.

FIG. 1 is a perspective view illustrating a display device according toan exemplary embodiment

A display device according to an exemplary embodiment includes a displaypanel PP, and a touch sensor TS disposed on a front surface of thedisplay panel PP.

The display panel PP displays predetermined visual information, forexample, text, a video, a picture, and a 2D or 3D image, through thefront surface. As long as a display panel displays an image, the kind ofdisplay panel PP is not particularly limited.

In the exemplary embodiment, the display panel PP may be one of anorganic light emitting display panel, a liquid crystal display panel, anelectrophoretic display panel, an electrowetting display panel, and aMicro ElectroMechanical System (MEMS) display panel. However, the kindof display panel PP is not limited thereto, and another display unit maybe used so long as the display unit is in accordance with the inventiveconcepts of the present disclosure.

The display panel PP may be provided in various shapes, for example, arectangular plate shape having two pairs of parallel sides. When thedisplay panel PP is provided in the rectangular plate shape, sides ofany one pair between the two pairs of sides may be provided to be longerthan sides of the other pair. In the exemplary embodiment, forconvenience of the description, the case where the display panel PP hasa rectangular shape having a pair of long sides and a pair of shortsides is present.

However, the shape of the display panel PP is not limited thereto, andthe display panel PP may have various shapes. For example, the displaypanel PP may be provided in various shapes, such as a polygon having aclosed shape including a straight side, a circle and an ellipseincluding a curved side, and a semicircle and a half ellipse including aside formed of a straight line and a curved line. In the exemplaryembodiment, when the display panel PP has a straight side, at least aportion of the corners of each shape may be formed of a curved line. Forexample, when the display panel PP has the rectangular shape, a portion,in which the adjacent straight sides meet, may be replaced with a curvedline having a predetermined curvature. That is, a vertex portion of therectangular shape may be formed of a curved side, of which both adjacentends may be connected to two adjacent straight sides and which has apredetermined curvature. The curvature may be differently set accordingto a position. For example, the curvature may be changed according to astart position of the curved line, a length of the curved line, and thelike.

The entirety or at least a portion of the display panel PP may haveflexibility. For example, the display panel PP may have flexibility inan entire area, or may have flexibility in an area corresponding to aflexible area.

The display panel PP includes a display area DA, in which pixels PX aredisposed so that an image is displayed, and a non-display area NDA,which is positioned at least one side of the display area DA. Forexample, the non-display area NDA may surround the display area DA.

The display area DA may be provided in a shape corresponding to a shapeof the display panel PP. For example, the DA may be provided in variousshapes, such as a polygon having a closed shape including a straightside, a circle and an ellipse including a curved side, and a semicircleand a half ellipse including a side formed of a straight line and acurved line, like the shape of the display panel PP. In the exemplaryembodiment, the display area DA may be provided in a rectangular shape.

In the display device according to the exemplary embodiment, theplurality of pixels PXL is disposed in the display area DA. The pixelsPXL may be arranged in a matrix shape having rows and columns. However,the arrangement scheme of the pixels PXL may be differently set. In theexemplary embodiment, the pixel PXL may be any one of a blue pixelemitting blue light, a green pixel emitting green light, and a red pixelemitting red light. However, the color of light emitted by each pixelPXL is not limited thereto, and light of a different color, for example,magenta light, yellow light, cyan light, white light, and the like mayalso be emitted.

The touch sensor TS may be disposed on the display panel PP. The touchsensor TS detects a touch position and/or a touch pressure when a usertouches the display panel. In the exemplary embodiment, the touch sensorTS may detect a fingerprint. The touch sensor may be a sensor of variousschemes, for example, a capacitance method, a resistive method, and apiezoelectric method.

The touch sensor TS may be provided in a plate shape corresponding tothe shape of the display panel PP, and covers at least a portion of thefront surface of the display panel PP. For example, when the displaypanel PP is provided in a rectangular shape, the touch sensor TS mayalso be provided in a rectangular shape corresponding to the rectangularshape of the display panel PP. Otherwise, when the display panel PP isprovided in a circular shape, the touch sensor TS may also be providedin a circular shape corresponding to the circular shape of the displaypanel PP.

The entirety or at least a portion of the touch sensor TS may haveflexibility. For example, the touch sensor TS may have flexibility in anentire area, or may have flexibility in an area corresponding to aflexible area.

The touch sensor TS may include a touch area TA, which is capable ofdetecting a touch of a user, and a non-touch area NTA disposed at leastat one side of the touch area TA. In the exemplary embodiment, thenon-touch area NTA surrounds the touch area TA.

The touch area TA may correspond to the display area DA. The non-toucharea NTA may correspond to the non-display area NDA. Accordingly, whenviewed on a plane, the touch area TA and the display area DA may overlapeach other and the non-touch area NTA and the non-display area NDA mayalso overlap each other. However, the sizes or the shapes of the toucharea TA and the non-touch area NTA are not limited thereto. For example,the touch area TA may be extended to a portion of the non-display areaNDA.

In the exemplary embodiment, the touch sensor TS may include a printedcircuit board PB, which is disposed in the non-touch area NTA and iselectrically connected to one or more touch electrodes.

A sensor controller controlling the touch sensor TS may be disposed onthe printed circuit board PB. The sensor controller may control anoperation of the touch sensor. In the exemplary embodiment, the sensorcontroller may detect capacity or resistance of the touch sensor TS todetect a touch position and/or a touch pressure from a user's finger orobject held by the user (e.g., a stylus pen).

Although it is not illustrated, an adhesive may be disposed between thetouch sensor TS and the display panel PP. The adhesive may bond two thetouch sensor TS and the display panel PP, which are adjacent constituentelements. In the exemplary embodiment, the adhesive may serve to bondtwo adjacent constituent elements into one form, and disperse stressapplied to the two constituent elements. To this end, the adhesive maybe selected from adhesives having bonding force and elasticity ofpredetermined ranges. Various adhesives of various thicknesses may beused as the adhesive mentioned in the present specification so long asthey satisfy the aforementioned function.

In the exemplary embodiment, the term “adhesive” is used to denote anelement that is provided between two adjacent constituent elements toconnect them. The term “adhesive” includes a pressure-sensitiveadhesive, which merely physically combines two constituent elements, butdoes not chemically combine the two constituent elements to allow thetwo constituent elements to be separated. The term “adhesive” alsoincludes a non-pressure-sensitive adhesive or one that physically andchemically combines two adjacent constituent elements and bonds the twoconstituent elements to be in a non-separable state. The actual type ofadhesive may be vary depending on whether the purpose is to permanentlybond adjacent constituent elements or whether to remove adjacentconstituent elements later through a peel-off method, and hereinafter,both the former and the latter are indicated as the adhesives.

The adhesive between the touch sensor TS and the display panel PP may bea pressure-sensitive adhesive, which enables the touch sensor TS and thedisplay panel PP to be peeled off.

The adhesive may include an optically transparent adhesive which allowsan image to maximally pass through from the display panel PP. Theadhesive may include one or more materials selected from the groupconsisting of polyester, polyether, polyurethane, epoxy, silicon, andacryl.

However, the touch sensor TS may be laid on the display panel PP withthe adhesive or may be directly laid on the display panel PP. Ifdirectly laid on the display panel PP, the adhesive may not be disposedbetween the touch sensor TS and the display panel PP.

Hereinafter, the display device according to the exemplary embodimentwill be described based on the touch sensor TS with reference to FIGS.2, 3A, 3B, and 3C.

FIG. 2 is a top plan view illustrating the touch sensor according to theexemplary embodiment. FIG. 3A is a cross-sectional view taken along lineI-I′ of FIG. 2, FIG. 3B is a cross-sectional view taken along lineII-II′ of FIG. 2, and FIG. 3C is a top plan view of the touch sensor,and illustrates only an insulating layer.

Referring to FIGS. 2, 3A, 3B, and 3C, the touch sensor includes asupport layer SP that includes the touch area TA and the non-touch areaNTA surrounding the touch area TA, a sensing electrode part SEP disposedin the touch area TA of the support layer SP, wires connected to thesensing electrode part SEP, and an insulating layer INS covering thetouch area and a portion of the non-touch area NTA.

In the exemplary embodiment, a substrate SUB, to which the touch sensorTS is attached, may be disposed at an external side of the support layerSP.

The support layer SP includes the touch area TA and the non-touch areaNTA. The sensing electrode part SEP may be disposed on the touch area TAof support layer SP. The non-touch area NTA of the support layer SP maybe adjacent to at least one side of the touch area TA.

In the exemplary embodiment, the touch sensor TS is disposed on thesubstrate SUB. Each element described below will be described accordingto a lamination sequence.

The substrate SUB may be various elements. For example, the substrateSUB may be an encapsulation layer disposed on a uppermost portion of thedisplay panel PP, a functional film, such as a polarizing film or aphase difference film, and a window disposed on the front surface of thedisplay panel PP. As another example, the substrate SUB may be aninsulating substrate, and in this case, the insulating substrate may beformed of an insulating material, such as glass and resin. As anotherexample, the substrate may be formed of a material having flexibility soas to be bendable or foldable, and may have a single-layer structure ofa multi-layer structure. Particularly, the substrate SUB may be a filmincluding a thermoplastic resin, such as a polyester-based resinincluding polyethylene terephthalate, polyethylene isophthalate, andpolybutylene terephthalate, a cellulose-based resin including diacetylcellulose and triacetyl cellulose, a polycarbonate-based resin, anacryl-based resin including polymethyl(meta) acrylate andpolyethyl(meta) acrylate, a styrene-based resin including polystyreneand acrylonitrile-styrene copolymer, a polyolefin resin includingpolyethylene, polypropylene, and cyclo-based or norbornene-basedstructure, a polyolefin-based resin including an ethylene propylenecopolymer, a vinyl chloride-based resin, a poly amide-based resinincluding nylon and aromatic polyamide, an imide-based resin, apolyether sulfone-based resin, a sulfone-base resin, apolyetherkethone-based resin, a polyphenylene sulfide, a vinylalcohol-based resin, a vinylidene chloride resin, a vinyl butyric resin,an arylate-based resin, a polyoxymethylene resin, and an epoxy-basedresin, and also be a film including a blended material of thethermoplastic resins. As a further example, the substrate SUB may alsouse a film formed of thermosetting resin such as a (meta)acryl-basedresin, a urethane-based resin, an acryl urethane-based resin, anepoxy-based resin, and a silicone-based resin, or an ultraviolet curableresin. However, the material of the substrate may be variously changed,and the substrate may be formed of Fiber Glass Reinforced Plastic (FRP)and the like.

The support layer SP is disposed on the substrate SUB. The sensingelectrode part SEP, the wires WR, pads PD, and the like, which are to bedescribed below, are directly formed on an upper surface of the supportlayer SP.

The support layer SP may be formed of an organic material havingflexibility, and may have a single-layer structure of a multi-layerstructure. For example, the support layer SP may be selected from thematerials of the substrate SUB, and the substrate SUB and the supportlayer SP may be formed of the same material or different materials. Inthe exemplary embodiment, the support layer SP may include at least oneof polystyrene, polyvinyl alcohol, polymethyl methacrylate,polyethersulfone, polyacrylate, polyetherimide, polyethylenenaphthalate, polyethylene terephthalate, polyphenylene sulfide,polyarylate, polyimide, polycarbonate, triacetate cellulose, celluloseacetate propionate, polyamide, polyamic acid, polyethylene, polystyrene,polynorbornene, polymaleimide copolymer, polyazobenzene,polyphenylenephthalamide, polyester, cinnamate-based polymer,coumarin-based polymer, phthalimidine-based polymer, chalcone-basedpolymer, cyclo polyolefin-based polymer, and aromatic acetylene-basedpolymer materials.

The support layer SP may have various refractive indexes according to amaterial used. When the support layer SP is formed in a single layer ora multi-layer, the support layer SP may further include a refractiveindex matching layer, or the support layer SP itself may be used as arefractive index matching layer. Otherwise, the support layer SP or therefractive index matching layer may include a high refractive material,for example, nano particles.

The support layer SP serves as a separation layer during themanufacturing of the touch sensor TS, which will be described below in amethod of manufacturing the touch sensor TS.

An adhesive ADH connecting the substrate SUB and the support layer SPmay be provided between the support layer SP and the substrate SUB. Theadhesive ADH may be an optically transparent adhesive ADH allowing animage from the display panel PP to maximally pass through. Here, theadhesive ADH provided between the substrate SUB and the support layer SPmay be a photocurable adhesive hardened by light, such as ultravioletrays, and may permanently bond the substrate SUB and the support layerSP through hardening.

The sensing electrode part SEP is disposed on the support layer SP inthe touch area TA. The sensing electrode part SEP includes one or moretouch electrodes.

The wire WR is connected to the sensing electrode part SEP. The wire WRmay provide a signal to the sensing electrode part SEP or connect asignal from the sensing electrode part SEP to the touch controller. Thewire WR may be disposed in the non-touch area NTA. A portion of the wireWR (or one of many wires WR) may be disposed in the touch area TA so tothe sensing electrode part SEP. The pad PD to be connected to theprinted circuit board PB and the like may be disposed at an end of theother side of the wire WR that is not connected to the sensing electrodepart SEP.

The sensing electrode part SEP and the wire WR may be provided invarious forms according to the type of touch sensor TS. For example, thesensing electrode part SEP, the wire WR, and the pad PD may beimplemented to detect a touch by a mutual capacitance method or aself-capacitance method. In this case, the touch electrodes may beimplemented in a polygon, for example, a quadrangular shape including arectangle, a trapezoid, and a diamond. Otherwise, each of the touchelectrodes may be implemented in a circular shape. Otherwise, each ofthe touch electrodes may be extended in a predetermined direction, sothat the entire touch electrodes may have a stripe shape. The extensiondirection of some of the touch electrodes may be a long side direction(e.g., vertical), a short side direction (e.g., horizontal), or aninclined direction (e.g., oblique).

The sensing electrode part SEP, the wires WR, and/or the pad PD may beformed of at least one of conductive materials, such as metal, a metaloxide, conductive polymer, metal nano wire, carbon nano tube, andgraphene.

The metal may include at least one of cooper, silver, gold, platinum,palladium, nickel, tin, aluminum, cobalt, rhodium, iridium, iron,ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantalum,titanium, bismuth, antimony, lead, zinc, and an alloy thereof.

In the exemplary embodiment, a material of at least one of the sensingelectrode part SEP, the wires WR, and the pad PD may include asilver/palladium/copper alloy. Otherwise, a material of at least one ofthe sensing electrode part SEP, the wires WR, and the pad PD may be anickel/copper alloy or a conductive metal oxide.

The conductive metal oxide may include at least one of transparent metalcompounds, such as an Indium Tin Oxide (ITO), an Indium Zinc Oxide(IZO), an Antimony Zinc Oxide (AZO), an Indium Tin Zinc Oxide (ITZO), aZinc Oxide (ZnO), and a Tin Oxide (SnO₂), in addition to theaforementioned oxides of the metal. The conductive polymer may include apolythiophene-based compound, a polypyrrole-based compound, apolyaniline-based compound, a polyacetylene-based compound, and apolyphenylenether-based compound, and a mixture thereof, andparticularly, may include a PEDOT/PSS compound among thepolythiophene-based compounds.

In the drawings, the sensing electrode part SEP is illustrated as asingle layer for convenience. However, the sensing electrode part SEP,the wires WR, and the pad PD may be provided as a single layer or amulti-layer. In the exemplary embodiment, the sensing electrode partSEP, the wires WR, and the pad PD may be formed of the same number oflayers, but are not limited thereto and may also be formed of differentlayers.

For example, the sensing electrode part SEP may be formed as a singlelayer, and the wires WR and/or the pad PD may be formed of amulti-layer. Otherwise, a portion of the sensing electrode part SEP maybe formed as a single layer and the other portion of the sensingelectrode part SEP may be formed as a multi-layer, and the wires WRand/or the pad PD may be formed as a multi-layer. Otherwise, a portionof the sensing electrode part SEP may be formed as a single layer andthe other portion of the sensing electrode part SEP may be formed as amulti-layer, and the wires WR and/or the pad PD may be formed as asingle layer.

In the exemplary embodiment, the sensing electrode part SEP, the wiresWR, and the pad PD may be formed of the same material, but are notlimited thereto and may also be formed of different materials.

For example, the sensing electrode part SEP, the wires WR, and the padPD may be formed of only a conductive metal oxide. Otherwise, thesensing electrode part SEP may be formed of a conductive metal oxide,and the wires WR and/or the pad PD may be formed of metal. Otherwise,the sensing electrode part SEP may be formed of a conductive metaloxide, and the wires WR and/or the pad PD may be formed of a conductivemetal oxide and a metal alloy. Otherwise, the sensing electrode part SEPmay be formed of nano wires, and the wires WR and/or the pad PD may beformed of metal.

The insulating layer INS is provided on the substrate SUB. Particularly,the insulating layer INS covers the sensing electrode part SEP in thetouch area TA, and covers a portion of the support layer SP in thenon-touch area NTA. The insulating layer INS may be formed in variousthicknesses. For example, the insulating layer INS may have a thicknessof about 1 μm to about 10 In the exemplary embodiment, the insulatinglayer may have a thickness of about 3 μm to about 4 μm.

The insulating layer INS has an opening OPN exposing the pad PDconnected to the end of the wire WR. That is, the opening OPN isprovided in an area in which the pad PD is disposed. In the presentexemplary embodiment, it is illustrated that one opening OPN is providedin a quadrangular shape, but is not limited thereto, and may be providedwith different shapes and different numbers so long as the pad PD issufficiently exposed. The pad PD may be connected to the sensorcontroller through a separate wire, a flexible printed circuit board, atape carrier package, a connector, a chip on film, and the like throughthe opening OPN. For example, the pad PD may be connected to otherelements through an anisotropic conductive film and the like disposed inthe opening OPN.

A trench TCH, which is formed by removing a portion of the insulatinglayer INS in the non-touch area NTA, is provided. The insulating layerINS is not provided on the support layer SP in an area corresponding tothe trench TCH, so that an upper surface of the support layer SP isexposed.

The insulating layer INS is not provided on the support layer SP in thearea corresponding to the trench TCH. A width of the trench TCH may bechanged according to a height of the insulating layer, and may be about30 μm to about 70 and in the exemplary embodiment, a width of the trenchTCH may be about 50 The trench TCH is formed to have the width of theaforementioned range, so that it is possible to prevent the adhesive ADHfrom being from being insufficiently applied (including not beingapplied) to a portion, to which the insulating layer is not provided,during a roll-to-roll compressive transfer process to be describedbelow. Further, the trench TCH has the width of the aforementionedrange, so that it is possible to prevent bubbles from being generated inthe portion of the trench TCH.

The trench TCH is provided along a perimeter of the touch area TA whenviewed on a plane. Accordingly, the insulating layer INS may beseparated into two insulating layers INS1 and INS2 with the trench TCHinterposed therebetween. The first insulating layer INS1 covers thetouch area TA and a portion of the non-touch area NTA. The secondinsulating layer INS2 covers a portion of the non-touch area NTA. Thesecond insulating layer INS2 is also spaced apart from the firstinsulating layer INS1 and provided along a perimeter of the firstinsulating layer INS1 at an external side of the first insulating layerINS1.

The first insulating layer INS1 and the second insulating layer INS2have substantially the same height. The second insulating layer INS2serves as a spacer for maintaining a height of the insulating layer atan end portion of the non-touch area NTA. Because of its the height andposition, the second insulating layer INS2, may prevent the adhesive ADHfrom being insufficiently applied during a manufacturing process of thetouch sensor. For example, the second insulating layer INS2 may preventthe adhesive ADH from being insufficiently applied during a process ofcompressing and transferring the touch sensor TS in a roll-to-rollmethod.

The insulating layer has an opening OP exposing an upper surface of thepad PD in an area, in which the pad PD is formed. The opening OPN may bedisposed within the first insulating layer INS1 of the non-touch areaNTA. The pad PD may be connected to the sensor controller through otherseparate wires WR, a flexible printed circuit board, a tape carrierpackage, a connector, a chip on film, and the like through the openingOPN.

The insulating layer INS may include at least one of an organic materialand an inorganic material, and may have a single layer structure or amulti-layer structure. In the exemplary embodiment, an organic materialforming the support layer may be used as a material of the organiclayer. In the exemplary embodiment, the material of the insulating layermay include an organic material, such as a fluoro-based carbon compound,such as Teflon, polyepoxy, and benzocyclobutene, in addition to theorganic material, and the inorganic layer may use an inorganicinsulating material, such as polysiloxane, a silicon nitride, a siliconoxide, and a metal oxide including an aluminum oxide.

In the exemplary embodiment, a protection film PRT may be provided onthe insulating layer INS with the adhesive ADH interposed therebetween.In the present exemplary embodiment, it is illustrated that a thicknessof the adhesive ADH is not that much larger than a thickness of theprotection film PRT, but this is for convenience only. In the exemplaryembodiment, a thickness of the protection film PRT may be larger than athickness of the adhesive ADH.

The protection film PRT is may protect the touch sensor TS during theprocess of manufacturing the touch sensor TS and/or until the touchsensor TS is manufactured and then is delivered to a user. The touchsensor TS may be a complete product or a product in an intermediateoperation for manufacturing to complete.

The adhesive ADH may be disposed on the protection film PRT protectingthe surface of the touch sensor TS. The adhesive ADH may bond adjacentelements of the protection film PRT and the touch sensor TS. Theadhesive ADH may include one or more materials selected from the groupconsisting of polyester, polyether, polyurethane, epoxy, silicon, andacryl.

The adhesive ADH between the insulating layer and the protection filmPRT may be a pressure-sensitive adhesive, which physically combines twoconstituent elements, but does not chemically combine the twoconstituent elements to allow the two constituent elements to beseparated.

The protection film PRT is bonded to one surface of an adherend toprotect the adherend. The protection film PRT may be removed when thetouch sensor TS is attached to another element. The adhesive ADH may beremoved together with the protection film PRT when the protection filmPRT is removed. The pad PD may be connected with separate wires WR, aflexible printed circuit board, a tape carrier package, a connector, achip-on film, or the like after the protection film PRT and the adhesiveADH are simultaneously removed.

However, only the protection film PRT may be removed and the adhesiveADH may be left on the touch sensor as it is, and another element may beattached onto the adhesive ADH. That is, the protection film PRT isremoved, so that one surface of the adhesive ADH is exposed, and theexposed surface of the adhesive ADH may be attached to another element.In this case, the protection film PRT and the adhesive ADH may beprovided only to a portion excluding the pad PD.

As long as the protection film PRT protects an adhesive, the protectionfilm PRT is sufficient, and is not particularly limited. The protectionfilm PRT may be formed of various materials, for example, a metal sheet,an organic polymer sheet, and a rubber sheet.

The protection film PRT according to the exemplary embodiment may beformed of an organic polymer. The organic polymer may include at leastone of, for example, polyethylene, polypropylene, an ethylene-propylenecopolymer, an ethylene-vinyl acetate copolymer, an olefin-based polymer,polyethylene terephthalate, polyethylene naphthalate, polybutyleneterephthalate, polycarbonate, polyvinyl chloride, a vinyl acetate basedpolymer, polyphenylene sulfide, polyamide (nylon), polyamide, polyimide,polyetheretherketone, and polyether, but is not limited thereto. Thematerial of the substrate SUB, the material of the support layer SP, andthe material of the insulating layer INS may be used as the material ofthe protection film PRT within a limit of protecting an adherend.

In the touch sensor according to the exemplary embodiment, theinsulating layer having the trench TCH may be provided in various formswhen viewed on a plane. In the exemplary embodiment below, in order toavoid the overlapping of the description, different matters from thoseof the aforementioned exemplary embodiment will be mainly described.Non-described parts follow the parts of the described exemplaryembodiment.

FIGS. 4A and 4B are top plan views illustrating touch sensors accordingto exemplary embodiments.

Referring to FIG. 4A, an insulating layer has trenches TCH formed byremoving a portion of the insulating layer in a non-touch area NTA, andthe number of trenches TCH may be two or more. In the present exemplaryembodiment, the case where the two trenches TCH are formed isillustrated as an example.

The insulating layer is not provided on a support layer SP in an areacorresponding to the trench TCH. The trench TCH is provided with a widthin a degree, in which an adhesive ADH is prevented from beingnon-applied or from being insufficiently applied to a portion, in whichthe insulating layer is not provided, in a roll-to-roll compressivetransfer process. The roll-to-roll compressive transfer process will bedescribed below.

The trench TCH may have an internal trench TCH and an external trenchTCH′ provided along a perimeter of the touch area TA. In this case, theinsulating layer has three insulating layers INS1, INS2′, and INS2″,which are spaced apart from one another by the internal trench TCH andthe external trench TCH′. The innermost insulating layer INS1 completelycovers the touch area TA, and covers a portion of the non-touch area NTAalong the perimeter of the touch area TA. The center insulating layerINS2′ is a ring shape closed along a perimeter of the innermostinsulating layer INS1, and surrounds the innermost insulating layerINS1. The outer insulating layer INS2″ is a ring shape closed along aperimeter of the center insulating layer INS2′, and surrounds the centerinsulating layer INS2′.

Referring to FIG. 4B, the insulating layer has a trench TCH formed byremoving a portion of the insulating layer in the non-touch area NTA,and an air path AR, through which air is dischargeable to the outside,may be provided in the trench TCH. One or two or more air paths AR maybe provided, and a position thereof is not particularly limited. The airpath AR connected to the trench TCH enables air from portions where theinsulating layer is not provided (e.g., the trench) to be easilydischarged to the outside during the roll-to-roll compressive transferprocess. When an air layer or air drops are non-uniformly present withinthe trench TCH, the adhesive may be non-uniformly applied during theroll-to-roll compressive transfer process, so that the air path ARenables air to be easily discharged to the outside, thereby decreasingthe non-uniform application of the adhesive.

The touch sensor according to the exemplary embodiment may beimplemented in various forms. FIGS. 5A and 5D are cross-sectional viewsillustrating touch sensors according to exemplary embodiments, and arecross-sectional views taken along line I-I′ of FIG. 2.

Referring to FIG. 5A, in a touch sensor according to an exemplaryembodiments, an insulating layer INS may be provided with multiplelayers. The insulating layer INS having multiple layers may have duallayers or three or more layers. In the exemplary embodiment, the casewhere the insulating layer is formed of a first insulating layer INS1and a second insulating layer INS2, which are spaced apart from eachother with a trench TCH interposed therebetween, will be described.

The first insulating layer INS1 is disposed on a sensing electrode partSEP, and includes a first sub insulating layer INS1 a and a second subinsulating layer INS1 b which are sequentially laminated. The secondinsulating layer INS2 also includes a first sub insulating is layer INS2a and a second sub insulating layer INS2 b which are sequentiallylaminated.

In the first insulating layer INS1, the first sub insulating layer INS1a is disposed on the sensing electrode part SEP and covers the sensingelectrode part SEP. The second sub insulating layer INS1 b is disposedon the first sub insulating layer INS1 a. The first sub insulating layerINS1 a and the second sub insulating layer INS1 b overlap in a toucharea TA. The first sub insulating layer INS1 a and the second subinsulating layer INS1 b partially overlap in a non-touch area NTA. Inthe present exemplary embodiment, it is illustrated that the second subinsulating layer INS1 b partially overlaps the first sub insulatinglayer INS1 a. In this case, when viewed on a plane, a size (e.g., awidth) of the second sub insulating layer INS1 b may be larger than asize of the first sub insulating layer INS1 a.

However, the sizes of the first sub insulating layer INS1 a and thesecond sub insulating layer INS1 b are not limited thereto. Referring toFIG. 5B, when viewed on a plane, a size (e.g., a width) of the secondsub insulating layer INS1 b may be smaller than a size of the first subinsulating layer INS1 a. Referring to FIG. 5C, a size (e.g., a width) ofthe first sub insulating layer INS1 a is smaller than a size of thesecond sub insulating layer INS1 b. The second sub insulating layer INS1b may cover all of an upper surface and lateral surfaces of the firstsub insulating layer INS1 a in FIG. 5C. In addition, although notillustrated, according to the exemplary embodiment, the first subinsulating layer INS1 a and the second sub insulating layer INS1 b areprovided with the same size and the same form to completely overlap eachother. In this case, an end portion of the first sub insulating layerINS1 a and an end portion of the second sub insulating layer INS1 b maycorrespond to each other.

Referring to FIGS. 5A, 5B, and 5C, the second insulating layer INS2 mayalso be provided in a similar form to that of the first insulating layerINS1. That is, when viewed on a is plane, the first sub insulating layerINS2 a is disposed at a side of an end portion of the touch sensor, andthe second sub insulating layer INS2 b is disposed on the first subinsulating layer INS2 a. In the second insulating layer INS2, the firstsub insulating layer INS2 a may overlap at least a portion of the firstsub insulating layer INS2 a. In the present exemplary embodiment, awidth of the trench TCH between the second sub insulating layer INS1 bof the first insulating layer INS1 and the second sub insulating layerINS2 b of the second insulating layer INS2 may be the same as ordifferent from a width of the trench TCH between the first subinsulating layer INS1 a of the first insulating layer INS1 and the firstsub insulating layer INS2 a of the second insulating layer INS2. As canbe seen in the exemplary embodiments of FIGS. 5A, 5B, and 5C, a width ofthe trench TCH between the second sub insulating layer INS1 b of thefirst insulating layer INS1 and the second sub insulating layer INS2 bof the second insulating layer INS2 may be smaller or larger than awidth of the trench TCH between the first sub insulating layer INS1 a ofthe first insulating layer INS1 and the first sub insulating layer INS2a of the second insulating layer INS2. According to the exemplaryembodiment, the thicknesses of the first sub insulating layer INS1 a andthe second sub insulating layer INS1 b may be changed to various forms,and are not limited to the aforementioned exemplary embodiments. Forexample, a thickness of the first sub insulating layer INS1 a may bedifferent from a thickness of the second sub insulating layer INS1 b.Referring to FIG. 5D, a thickness of the second sub insulating layerINS1 b of the first insulating layer INS1 provided on the sensingelectrode part SEP may be larger than a thickness of a thickness of thefirst sub insulating layer INS1 a of the first insulating layer INS1.The thicknesses of the first and second insulating layers INS2 a andINS2 b of the second insulating layer INS2 may be provided in the sameform as that of the first insulating layer INS1.

The aforementioned exemplary embodiments may be partially transformed oris combined so long as it is not contrary to the inventive concepts. Forexample, in the aforementioned exemplary embodiments, it is illustratedthat the heights of the first insulating layer INS1 and the secondinsulating layer INS2 are substantially the same, but the presentdisclosure is not limited thereto, and the first insulating layer INS1and the second insulating layer INS2 may have different heights.Further, in the exemplary embodiment illustrated in FIG. 5A, in thefirst insulating layer INS1 may have first and second sub insulatinglayers INS1 a and INS1 b with different thicknesses, similar to those ofthe exemplary embodiment illustrated in FIG. 5D.

The touch sensor may be manufactured by a method described below.Hereinafter, a method of manufacturing the touch sensor illustrated inFIG. 2 among the touch sensors will be sequentially described.

FIGS. 6A, 6B, 6C, 6D, 6E, 6F, and 6G are cross-sectional viewssequentially illustrating a method of manufacturing the touch sensoraccording to an exemplary embodiment. In the drawings below, the casewhere one touch sensor is formed is illustrated as an example forconvenience, but the present disclosure is not limited thereto. Instead,a plurality of touch sensors may be formed on one mother substrate, andthen the mother substrate may be cut to form the touch sensor. A processof cutting the mother substrate will be described with reference to FIG.7.

Referring to FIG. 6A, the support layer SP is formed on a carriersubstrate CR.

As long as the touch sensor may be formed on an upper surface of thecarrier substrate CR, the carrier substrate CR is not particularlylimited, and may be formed of glass or plastic.

The support layer SP is a layer for forming a sensing electrode partSEP, wires is (not illustrated), and a pad (not illustrated) forming thetouch sensor, and is formed so as to easily separate the touch sensorfrom the carrier substrate CR after the touch sensor is manufactured.

The support layer SP may be manufactured by forming an organic polymermaterial on the carrier substrate CR and then hardening the organicpolymer material.

The support layer SP may be formed in a single layer or multiple layers,and when the support layer SP is in the multiple layers, the process offorming the support layer SP may be repeated several times.

The support layer SP may be formed in various methods. For example, thesupport layer SP may be formed by a printing method, a coating method, adispensing method, and the like. For example, the support layer SP maybe formed by any one of a printing method, such as screen printing,inkjet printing, and nozzle printing, a coating method, such as slitcoating, spin coating, and spray coating, and a dispensing method usinga dispenser. In the exemplary embodiment, the support layer SP may beformed by the coating method.

The support layer SP may be easily manufactured by the aforementionedmethod, and may be manufactured with a very small thickness compared tothat of the related art.

The carrier substrate CR and the hardened support layer SP are in acontact state, and may be bonded to each other by static electricity orvan der Waals force. Here, the carrier substrate CR and the supportlayer SP are bonded, but the meaning of the bonding includes a contactof the surfaces of the carrier substrate CR and the support layer SP,but excludes a state where the carrier substrate CR and the supportlayer SP are chemically bonded (for example, covalent bond) and are notseparated. A separate layer, such as a separate adhesive ADH, other thanan air layer, is not interposed between the carrier substrate CR and thesupport layer SP. When force is applied from the outside of the carriersubstrate CR and the support layer SP, the carrier substrate CR and thesupport layer SP are in a state of being easily separated withoutdamage.

Referring to FIG. 6B, the sensing electrode part SEP is formed on thesupport layer SP. Although not illustrated, wires and/or a pad may beformed with the sensing electrode part SEP together or may be separatelyformed from the sensing electrode part SEP. The sensing electrode partSEP, the wires, and the pad may be formed with various method, such aschemical vapor deposition, physical vapor deposition, printing, andplating. For example, the electrode part SEP, the wires, and the pad maybe manufactured by forming a conductive layer by using chemical vapordeposition and patterning the conductive layer by photolithography.

Referring to FIG. 6C, the insulating layer is formed on a substrate, onwhich the sensing electrode part SEP and the like are formed. Theinsulating layer is formed to have the trench TCH formed by removing aportion of the insulating layer in the non-touch area. The insulatinglayer INS is not provided on the support layer SP in an areacorresponding to the trench TCH, so that an upper surface of the supportlayer SP is exposed.

The trench TCH is provided along a perimeter of the touch area TA whenviewed on a plane. Accordingly, the insulating layer INS may be formedof the insulating layers INS1 and INS2, which are spaced apart from eachother with the trench TCH interposed therebetween. The second insulatinglayer INS2 is provided along the perimeter of the first insulating layerINS1 at an external side of the first insulating layer INS1.

Further, the insulating layer is formed to have an opening exposing apad connected to an end portion of the wire in an area corresponding tothe pad in the non-touch area. An upper surface of the pad is exposedthrough the opening.

The insulating layer INS may be formed in various methods. For example,the insulating layer INS may be formed by a printing method, a coatingmethod, a dispensing method, and the like. For example, the insulatinglayer INS may be formed by any one of a printing method, such as screenprinting, inkjet printing, and nozzle printing, a coating method, suchas slit coating, spin coating, and spray coating, and a dispensingmethod using a dispenser. In the exemplary embodiment, the insulatinglayer INS may be formed by the coating method.

In the insulating layer INS, the trench TCH and the opening may beprovided by forming the insulating layer on a front surface of thecarrier substrate CR and then patterning the insulating layer by usingphotolithography. Otherwise, the trench TCH and the opening may beformed by a method of forming the insulating layer only in a portionexcept for the area, in which the trench TCH or the opening is to beformed, during the printing, the coating, and the dispensing.

Here, the first insulating layer INS1 and the second insulating layerINS2 may be manufactured in a single process as described above, andthus, the first insulating layer INS1 and the second insulating layerINS2 may be formed of the same material. Further, the first insulatinglayer INS1 and the second insulating layer INS2 may substantially beformed with have the same height. However, the first insulating layerINS1 and the second insulating layer INS2 may be separately manufacturedin different processes, so that even in this case, the first insulatinglayer INS1 and the second insulating layer INS2 are substantially formedto have the same height.

Referring to FIG. 6D the protection film PRT is attached on the carriersubstrate CR, on which the insulating layer and the like are formed,with the adhesive ADH interposed therebetween. The protection film PRTand the adhesive ADH may be bonded by using a first is roller R1. Thatis, the protection film PRT may be attached onto the insulating layer bycompressing the adhesive ADH and the protection film PRT onto thecarrier substrate CR, on which the insulating layer and the like areformed, by using the first roller R1. In this case, the trench TC andthe opening may be entirely or partially filled with the adhesive ADH.

Referring to FIG. 6E, the used carrier substrate CR is removed in orderto perform a touch sensor process. The method of removing the carriersubstrate CR is not particularly limited, and a lift-off method or apeel-off method may be used. In the exemplary embodiment, the method ofremoving the carrier substrate CR is performed by a method of separatingthe support layer SP and the carrier substrate CR by using a secondroller R2.

Referring to FIG. 6F, the touch sensor manufactured by theaforementioned method is bonded onto the substrate SUB. The touch sensormay be attached onto the substrate SUB with the adhesive ADH interposedtherebetween. In the exemplary embodiment, the touch sensor is attachedonto the substrate by disposing a third roller R3 and a fourth roller R4so as to face each other, and making the substrate SUB formed with theadhesive ADH and the touch sensor pass between the third roller R3 andthe fourth roller R4 while compressing the substrate SUB formed with theadhesive ADH and the touch sensor. That is, the touch sensor isseparated from the carrier substrate CR by the roll-to-roll method andis transferred onto the substrate SUB. Herein, the substrate SUB may bean element, to which the touch sensor is desired to be attached, andvarious elements, for example, a display panel, a functional film, and awindow, may be used.

Referring to FIG. 6G, a final product formed by attaching the touchsensor onto the substrate through the aforementioned process iscompleted.

In the manufacturing method according to the exemplary embodiment, thetouch is sensors may be separately formed one by one, but the pluralityof touch sensors may also be simultaneously formed. FIG. 7 is a top planview illustrating the case where the plurality of touch sensors issimultaneously manufactured according to an exemplary embodiment.

In the present exemplary embodiment, in order to describe the case wherethe plurality of touch sensors is simultaneously manufactured, a mothersubstrate M_SUB for forming six touch sensors is illustrated, but thepresent disclosure is not limited thereto, and the mother substratesM_SUB having various sizes may be used for forming the various number oftouch sensors.

The present exemplary embodiment is partially different from the abovecase in that the plurality of touch sensors is simultaneouslymanufactured on the large mother substrate M_SUB, but the elementsformed on each mother substrate M_SUB are substantially the same as theelements of the individual touch sensor. The manufacturing method is notsubstantially different except that a carrier substrate CR, a supportlayer SP, and the like having large sizes are prepared forsimultaneously forming the plurality of touch sensors. The mothersubstrate M_SUB has a unit area UNT for forming each of the touchsensors, and the touch sensor is formed within each unit area UNT. Theunit area UNT is cut along a cutting line CT later, and thus, theplurality of touch sensors may be simultaneously formed.

This will be described with reference to FIGS. 6A to 6F, and FIG. 7.First, a carrier substrate CR substantially having the same size as thatof a mother substrate M_SUB may be prepared. A support layer SP isformed on the carrier substrate CR. The support layer SP has theplurality of unit areas UNT according to the number of touch sensorsdesired to be manufactured, and a sensing electrode part SEP, wires, apad, and the like are formed in each unit area UNT of the support layerSP. Next, an insulating layer INS having a trench TCH is is formed ineach of the unit areas UNT. A protection film PRT substantially havingthe same size as that of the mother substrate M_SUB is bonded onto eachinsulating layer INS with an adhesive ADH interposed therebetween, andnext, the carrier substrate CR is removed. The touch sensors, in whichthe carrier substrate CR is removed, are bonded to the mother substrateM_SUB with the adhesive ADH interposed therebetween. The touch sensorsformed on the mother substrate M_SUB are cut into the separate touchsensors by using a cutter, a laser, or the like to finally complete atouch sensor.

The touch sensor according to the exemplary embodiment having theaforementioned structure and manufactured by the aforementioned methodhas a decreased defect compared to the related art, which will bedescribed below.

According to the related art, an insulating layer covering a sensingelectrode part is extended up to an end portion of a support layer. Inthis case, a defect, such as a crack, may be generated in the endportion of the insulating layer during a process of cutting a mothersubstrate, and external gas (for example, oxygen) or moisture permeatesinto an inner side through the defect, so that there is a problem inthat the sensing electrode part, wires, a pad, and the like aredegraded. That is, there is a problem in that an ITO of the sensingelectrode part, the wires, and the pad is corroded or a metal isoxidized, and the problem eventually causes an increase in resistance, ashort circuit between the wires, the degradation of a detection of atouch, and the like.

When the insulating layer covers the touch area, but is not formed atthe side of the end portion in order to prevent the problem, a step isgenerated in a portion, in which the insulating layer is not formed,during the compressive transfer in the roll-to-roll process, and theadhesive is not applied or applied in an amount that is too small due toa step difference. The is reason is that the adhesive is pushed to theoutside by the compression during the transfer of the touch sensor inthe roll-to-roll method and thus the adhesive is insufficiently appliedor is not applied at the end portion. This results in a decrease in athickness of the adhesive between the substrate and the touch sensor inthe area of the end portion of the touch sensor. When the thickness ofthe adhesive is decreased between the substrate and the support layer,tensile strength of the touch sensor is decreased. The adhesivegenerally has predetermined elastic force and serves to relieve externalstress, such as bending, but when a thickness of the adhesive is toosmall, elastic force is decreased and it is difficult to relieveexternal stress. As a result, a defect, such as a crack, is generated inthe sensing electrode part, the wires, the pad, and the like by stressapplied from the outside. For example, a crack may be generated in thewire even by stress of about 500 gF/cm.

In addition to this, the substrate and the support layer are easilydetached, and the support layer is easily lifted from the substrate, sothat external gas or moisture easily permeates into the sensingelectrode part, the wires, the pad, and the like on the support layer.As a result, there is a problem in that the sensing electrode part, thewires, the pad, and the like in the end portion of the touch sensor arecorroded or oxidized, and in this case, resistance is increased, a shortcircuit is generated between the wires, and a touch detection isdegraded.

However, according to the exemplary embodiment, the first insulatinglayer and the second insulating layer, which are spaced apart from eachother with the trench interposed therebetween, are formed, so that theaforementioned defect is prevented.

In the present disclosure, the first insulating layer covering thesensing electrode part and the like is formed, but is not formed in theend portion of the external side of the touch side and is not exposed tothe outside. Accordingly, when the cutting process and the like is isperformed, a defect, such as a crack, is not generated in the firstinsulating layer. In addition to this, the second insulating layer isprovided along an outer side of the touch sensor, and the heights of thefirst insulating layer and the second insulating layer are substantiallythe same, so that the phenomenon, in which the adhesive is notsufficiently applied, during the compression using the roll-to-rollmethod, is considerably decreased. The reason is that the secondinsulating layer serves as a spacer, so that a pressing phenomenon ofthe adhesive is decreased during the compression in the end portion ofthe touch sensor.

Table 1 below represents a result of a defect evaluation of the touchsensor according to a time in a high temperature high moistureenvironment in the touch sensor of the related art. Table 2 belowrepresents a result of a defect evaluation of the touch sensor accordingto a time in a high temperature high moisture environment in the touchsensor according to the exemplary embodiment.

The touch sensors used in Tables 1 and 2 are manufactured under the sameconditions, except for a shape of an insulating layer. The sensingelectrode parts of the touch sensors used in Tables 1 and 2 are formedof an ITO single layer, and the wires are formed of dual layers of anITO layer and an aluminum/palladium/copper alloy layer.

The touch sensor of Table 1 is manufactured in such a manner that theinsulating layer is not extended up to the end portion of the touchsensor. The touch sensor of Table 2 is manufactured in such a mannerthat a form of the first insulating layer is the same as that of Table1, but the first insulating layer and the second insulating layer, whichis spaced apart from the first insulating layer with the trenchinterposed therebetween, are formed in the end portion of the touchsensor. A defect of the touch sensor was evaluated based on corrosion ofan ITO layer and a bridge and a defect by a disconnection and a shortcircuit of the wires.

TABLE 1 Time (hrs.) 120 240 360 500 Number of 80 80 80 78 specimensNumber of 0 2 0 9 defects

TABLE 2 Time (hrs.) 120 240 360 500 Number of 126 126 126 126 specimensNumber of 0 0 0 0 defects

As can be seen in Tables 1 and 2, the touch sensor according to therelated art has a defect in a high temperature and humid environment,and particularly, a defect is generated in nine touch sensors among 78specimens after 500 hours. In contrast, the touch sensor according tothe present disclosure have no defect in all of the hours.

The touch sensor according to the exemplary embodiment may beimplemented in various forms. FIG. 8 is a top plan view illustrating atouch sensor according to an exemplary embodiment, and particularly,illustrates one example of a sensing electrode part SEP. FIG. 9 is across-sectional view of an enlarged portion PI of FIG. 8. FIG. 10 is across-sectional view taken along line of FIG. 9.

The touch sensor according to the exemplary embodiment is a capacitancetype, and may be provided in a mutual capacitance type and/or aself-capacitance type. In the exemplary embodiment below, the presentdisclosure will be described based on the touch sensor in the mutualcapacitance type as an example, but is not limited thereto.

First, referring to FIGS. 9 and 10, the touch sensor according to theexemplary embodiment includes first touch electrodes T1, second touchelectrodes T2, first and second wires WR1 and WR2, and pads PD. Thefirst touch electrodes T1 and the second touch electrodes T2 areprovided in a touch area TA.

In a non-touch area NTA of the touch sensor, the first wires WR1electrically connected with the first touch electrodes T1 may beprovided, and further, the second wires WR2 electrically connected withthe second touch electrodes T2 may be provided. Here, the first wiresWR1 may be connected to one end of a series of connected first touchelectrodes T1, and the second wires WR2 may also be connected to one endof a series of connected second touch electrodes T2.

In the exemplary embodiment, a sensor controller (not illustrated) maybe provided in the touch sensor TS. The sensor controller may beprovided in a form of a printed circuit board (PB), a tape carrierpackage, or a chip-on-film, and may be electrically connected to thepads through separate wires WR, a connector, and the like. Herein, theprinted circuit board or the tape carrier package may have flexibility.

The first touch electrodes T1 are formed on a support layer SP in, forexample, an X-axis direction (e.g., a horizontal direction). Forexample, each of the first touch electrodes T1 may be arranged in thesame row in the X-axis direction. The first touch electrodes T1 arrangedin each row may include a plurality of first bridges BR1 connecting thefirst touch electrodes T1 adjacent in the X-axis direction.

The first touch electrodes T1 are connected to the pads PD through thefirst wires WR1, respectively.

The second touch electrodes T2 are formed on the support layer SP in,for example, a Y-axis direction. For example, each of the second touchelectrodes T2 may be arranged in the same column in the Y-axisdirection. The second touch electrodes T2 arranged in each column mayinclude a plurality of second bridges BR2 connecting the second touchelectrodes T2 adjacent in the Y-axis direction.

The second touch electrodes T2 are connected to the pads PD through thesecond wires WR2, respectively.

In the exemplary embodiment, the first bridges BR1 may be integrallyformed with the first touch electrodes T1 in the corresponding rowwithout a separation. Otherwise, the second bridges BR2 may beintegrally formed with the second touch electrodes T2 in thecorresponding column without a separation. However, the presentdisclosure is not limited thereto, and the first bridges BR1 and/or thesecond bridges BR2 may also be changed to have a structure including oneor more bridges and be implemented.

For convenience of the description, the present exemplary embodimentdiscloses a case where the number of first bridges BR1 and the number ofsecond bridges BR2 between the two adjacent first touch electrodes T1 isone, but the number of first bridges BR1 and the number of secondbridges BR2 may be variously changed.

In the exemplary embodiment, FIG. 8 illustrates that the first andsecond touch electrodes T1 and T2 are shaped like a diamond, but theshapes of the first and second touch electrodes T1 and T2 may bevariously changed. For example, the first and second touch electrodes T1and T2 may be implemented in a circular shape.

In the exemplary embodiment, when the first touch electrodes T1 aredriving electrodes and the second touch electrodes T2 are receivingelectrodes, the first touch electrodes is T1 may receive driving signalsfrom the sensor controller through the pads PD, respectively, and thesecond touch electrodes T2 may output detection signals by a touch of auser to the sensor controller through the pads PD, respectively. In thiscase, the touch sensor of the exemplary embodiment may be driven in themutual capacitance method.

In the meantime, in the drawings, the first and second touch electrodesT1 and T2 are disposed in the X-direction and the Y-direction,respectively, but the present disclosure is not limited thereto. Forexample, the first touch electrodes T1 and/or the second touchelectrodes T2 may also disposed in a direction, for example, a diagonaldirection, other than the X-axis direction and the Y-axis direction.

In the exemplary embodiment, although not illustrated, at least aportion of the first touch electrodes T1 and the second touch electrodesT2 is provided in a mesh form formed of thin lines. For example, atleast one of the first touch electrodes T1 and the second touchelectrodes T2 may be formed to include one or more mesh-type conductivelayers. For example, at least one of the first touch electrodes T1 andthe second touch electrodes T2 may be provided in a form, in which thinlines extended in different directions cross one another, and the thinlines are connected to each other in crossing points when viewed on aplane. That is, when viewed on a plane, the first and second touchelectrodes T1 and T2 are provided in a form, in which a plurality ofopenings OPN is formed inside the first and second touch electrodes T1and T2.

In the exemplary embodiment, each of the first and/or second touchelectrodes T1 and T2 includes a conductive material. A metal, a metaloxide, a conductive polymer, metal nano wire, carbon nano tube,graphene, and the like may be used as the conductive material. The metalmay include at least one of cooper, silver, gold, platinum, palladium,nickel, tin, aluminum, cobalt, rhodium, iridium, iron, ruthenium,osmium, manganese, molybdenum, is tungsten, niobium, tantalum, titanium,bismuth, antimony, lead, zinc, and an alloy thereof. The conductivemetal oxide may include at least one of transparent metal compounds,such as an Indium Tin Oxide (ITO), an Indium Zinc Oxide (IZO), anAntimony Zinc Oxide (AZO), an Indium Tin Zinc Oxide (ITZO), a Zinc Oxide(ZnC), and a Tin Oxide (SnO₂), in addition to the aforementioned oxidesof the metal. The conductive polymer may include a polythiophene-basedcompound, a polypyrrole-based compound, a polyaniline-based compound, apolyacetylene-based compound, and a polyphenylenether-based compound,and a mixture thereof, and particularly, may include a PEDOT/PSScompound among the polythiophene-based compounds. In the exemplaryembodiment, the first and second touch electrodes T1 and T2 may beformed in a single layer or multiple layers.

The first bridge BR1 may include the aforementioned material of thefirst and/or second touch electrodes T1 and T2.

According to the exemplary embodiment, one of the first and second touchelectrodes T1 and T2 may be a driving electrode, and the other may be areceiving electrode. When a user inputs a touch to the first and secondtouch electrodes T1 and T2 or an area around the first and second touchelectrodes T1 and T2, mutual capacitance between the driving electrodeand the receiving electrode may be changed. The sensor controller maydetect whether the user inputs the touch and a touch position bydetecting a variation of mutual capacitance between the drivingelectrode and the receiving electrode.

Next, a lamination relation will be described below with reference toFIGS. 9 and 10.

The first touch electrodes T1, the second touch electrodes T2, thesecond bridges BR2, the first and second wires WR1 and WR2, and the padsPD are provided on the support is layer SP.

The substrate SUB may be provided under the support layer SP, and anadhesive ADH may be interposed between the support layer SP and thesubstrate.

First sub insulating layers INS1 a INS2 a are disposed on the firsttouch electrodes T1, the second touch electrodes T2, the second bridgesBR2, the first and second wires WR1 and WR2, and the pads PD. The firstsub insulating layers INS1 a INS2 a include a first sub insulating layerINS1 a of a first insulating layer INS1 and a first sub insulating layerINS2 a of a second insulating layer INS2, which are spaced apart fromeach other with a trench TCH interposed therebetween.

Contact holes CH exposing upper surfaces of the first touch electrodesT1 are provided in the first sub insulating layer INS1 a of the firstinsulating layer INS1.

The first bridge BR1 connecting the adjacent first touch electrodes T1is provided on the first sub insulating layer INS1 a of the firstinsulating layer INS1. The first bridges BR1 are connected to theadjacent first touch electrodes T1 through the contact hole CH.

Second sub insulating layers INS1 b and INS2 b are provided on the firstsub insulating layers INS1 a and INS2 a. The second sub insulatinglayers INS1 b INS2 b include a second sub insulating layer INS1 b of thefirst insulating layer INS1 and a second sub insulating layer INS2 b ofthe second insulating layer INS2, which are spaced apart from each otherwith the trench TCH interposed therebetween.

At least parts of the second sub insulating layers INS1 b and INS2 boverlap the first sub insulating layers INS1 a and INS2 a, and endportions of the external sides of the first sub insulating layers INS1 aand INS2 a and the second sub insulating layers INS1 b and INS2 b maycorrespond to each other or may be disposed at different positions whenviewed on a plane.

The protection film PRT may be provided on the second sub insulatinglayers INS1 b and INS2 b with the adhesive ADH interposed therebetween.

As described above, the touch sensor of the mutual capacitance type mayinclude the two laminated sub insulating layers INS, and may include thefirst insulating layer INS1 and the second insulating layer INS2, whichare divided based on the trench TCH formed along a perimeter of thetouch area TA.

It is illustrated that in the touch sensor according to the presentexemplary embodiment, the bridge is formed at an upper side of the touchelectrode, but the present disclosure is not limited thereto. Instead,the touch sensor may be implemented in a structure, in which the bridgesare formed at lower sides of the touch electrodes. Further, in thepresent exemplary embodiment, a structure, in which the first touchelectrodes T1 and the second touch electrodes T2 are substantiallydisposed on the same layer, is illustrated, but the present disclosureis not limited thereto. For example, according to an exemplaryembodiment, the first touch electrodes T1 and the second touchelectrodes T2 may also be disposed in the different layers.

The touch sensor according to the exemplary embodiment may be appliedinto a display device by various schemes. FIGS. 11A, 11B, 11C, and 11Dare cross-sectional views illustrating display devices according toexemplary embodiments.

Referring to FIG. 11A, a display device according to an exemplaryembodiment may include a display panel PP displaying an image, a windowWD provided on a front surface of the display panel PP, and a touchsensor TS provided between the display panel PP and the window WD.

The window WD may be provided in a plate shape corresponding to a shapeof is the display panel PP, and covers at least a portion of the frontsurface of the display panel PP. For example, when the display panel PPis provided in a rectangular shape, the window WD may also be providedin a rectangular shape corresponding to the rectangular shape of thedisplay panel PP. Otherwise, when the display panel PP is provided in acircular shape, the window WD may also be provided in a circular shapecorresponding to the circular shape of the display panel PP.

The window WD allows an image from the display panel PP to pass throughand relieves external impact, thereby preventing the display panel PPfrom being damaged or erroneously operated by the external impact. Theimpact from the outside refers to power from the outside expressible aspressure and stress, and means power causing a defect to the displaypanel PP.

The entirety or at least a portion of the window WD may haveflexibility. For example, the window WD may have flexibility in anentire area, or may have flexibility in an area corresponding to aflexible area.

The touch sensor TS may be disposed between the display panel PP and thewindow WD.

In the exemplary embodiment, the touch sensor TS may be bonded onto thedisplay panel PP with an adhesive interposed therebetween. In this case,in the touch sensor TS according to the exemplary embodiments, anelement corresponding to the substrate is the display panel PP. Inanother exemplary embodiment, the touch sensor TS may be bonded onto thewindow WD with an adhesive interposed therebetween. In this case, in thetouch sensor TS according to the exemplary embodiments, an elementcorresponding to the substrate is the window WD.

Otherwise, in the exemplary embodiments, the protection film PRT is forthe purpose of temporarily protecting the touch sensor TS, so that theprotection film PRT may be removed. Accordingly, after the protectionfilm PRT in an upper portion is removed in a state where the substrateof the touch sensor TS is maintained, the display panel PP or the windowWD, instead of the protection film PRT, may be attached to the touchsensor TS with the adhesive interposed therebetween.

According to the exemplary embodiments, according to an element, towhich the touch sensor TS is attached, or a disposition position of thetouch sensor TS, the upper surface and the lower surface of the touchsensor TS may be inverted. However, it is preferable to include anoperation of exposing an upper surface of the pad so that separate wiresWR, a flexible printed circuit board, a tape carrier package, aconnector, a chip on film, and the like are connectable.

Referring to FIG. 11B, a display device according to an exemplaryembodiment may include a display panel PP displaying an image, a windowWD provided on a front surface of the display panel PP, a touch sensorTS provided between the display panel PP and the window WD, and a buffermember BF and an additional sensor AE provide at an external side of thedisplay panel PP.

The additional sensor AE is for the purpose of detecting a pressure of atouch when a user inputs the touch. The additional sensor AE may besensors of various schemes, for example, a capacitive sensor detectingcapacitance with the touch sensor TS. In this case, the additionalsensor AE may be formed of a conductive material, for example, thematerials of the sensing electrode part or the wires, but is not limitedthereto.

The buffer member BF may be provided to the touch sensor TS and theadditional is sensor AE, and in the present exemplary embodiment, it isillustrated that the buffer member BF is provided between the displaypanel PP and the additional sensor AE. The buffer member BF may serve torelieve impact from the outside, and to this end, the buffer member BFmay have elastic force. For example, the buffer member BF may betransformed by a pressure from the outside, and may have elastic force,by which the buffer member BF is restorable to an original state, whenthe pressure from the outside is removed.

The disposition positions of the buffer member BF and/or the additionalsensor AE are not limited thereto, and the buffer member BF and/or theadditional sensor AE may be disposed at different positions in otherexemplary embodiments.

Referring to FIG. 11C, a display device according to an exemplaryembodiment may include a display panel PP displaying an image, a windowWD provided on a front surface of the display panel PP, a polarizinglayer POL provided between the display panel PP and the window WD, and atouch sensor TS provided between the display panel PP and the polarizinglayer POL.

The touch sensor TS may be disposed between the display panel PP and thepolarizing layer POL.

In the exemplary embodiment, the touch sensor TS may be bonded onto thedisplay panel PP with an adhesive interposed therebetween. In this case,in the touch sensor TS according to the exemplary embodiments, anelement corresponding to a substrate is the display panel PP. In anotherexemplary embodiment, the touch sensor TS may be bonded onto thepolarizing layer POL with an adhesive interposed therebetween. In thiscase, in the touch sensor TS according to the exemplary embodiments, anelement corresponding to the substrate is the polarizing layer POL.

Otherwise, in the exemplary embodiments, after a protection film PRT inan upper portion is removed in a state where the substrate of the touchsensor TS is maintained, the display panel PP or the polarizing layerPOL, instead of the protection film PRT, may be attached to the touchsensor TS with the adhesive interposed therebetween.

Referring to FIG. 11D, a display device according to an exemplaryembodiment may include a display panel PP displaying an image, a windowWD provided on a front surface of the display panel PP, a polarizinglayer POL provided between the display panel PP and the window WD, and atouch sensor TS provided between the polarizing layer POL and the windowWD.

The touch sensor TS may be disposed between the polarizing layer POL andthe window WD.

In the exemplary embodiment, the touch sensor TS may be bonded onto thepolarizing layer POL with an adhesive interposed therebetween. In thiscase, in the touch sensor TS according to the exemplary embodiments, anelement corresponding to a substrate is the polarizing layer POL. Inanother exemplary embodiment, the touch sensor TS may be bonded onto thewindow WD with an adhesive interposed therebetween. In this case, in thetouch sensor TS according to the exemplary embodiments, an elementcorresponding to the substrate is the window WD.

Otherwise, in the exemplary embodiments, after a protection film PRT inan upper portion is removed in a state where the substrate of the touchsensor TS is maintained, the polarizing layer POL or the window WD,instead of the protection film PRT, may be attached to the touch sensorTS with the adhesive interposed therebetween.

The touch sensor according to the exemplary embodiment may be applied tois various display devices. The display device may be applied to variouselectronic devices. For example, the display device may be an elementapplied to a television, a notebook computer, a mobile phone, a smartphone, a smart pad, a Portable Multimedia Player (PDP), a PersonalDigital Assistant (PDA), a navigation device, various wearable devices,such as a smart watch, and the like.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concept is not limitedto such embodiments, but rather to the broader scope of the presentedclaims and various obvious modifications and equivalent arrangements.

What is claimed is:
 1. A touch sensor, comprising: a support layercomprising a touch area and a non-touch area surrounding the touch area;a sensing electrode part disposed on one side of the support layer inthe touch area; and an insulating layer disposed on the one side of thesupport layer in the touch area and in a portion of the non-touch area,wherein the insulating layer has a trench disposed along a perimeter ofthe touch area in the non-touch area to fully surround the touch area,wherein the insulating layer comprises: a first insulating part disposedin the touch area and in a portion of the non-touch area that isdirectly adjacent to the touch area; and a second insulating partdisposed along a perimeter of the first insulating part in the non-toucharea with the trench interposed between the first insulating part andthe second insulating part, and wherein the one side of the supportlayer is exposed in the trench, and wherein the first insulating part isnot interposed between the support layer and the sensing electrode part.2. The touch sensor of claim 1, wherein at least one of the firstinsulating part and the second insulating part comprises multiplelayers.
 3. The touch sensor of claim 2, wherein the first insulatingpart and the second insulating part each comprise a first sub insulatinglayer disposed on the support layer and a second sub insulating layercovering the first sub insulating layer.
 4. The touch sensor of claim 1,wherein the sensing electrode part comprises first touch electrodes andsecond touch electrodes that are spaced apart from the first touchelectrodes and are configured to form capacitance with the first touchelectrodes.
 5. The touch sensor of claim 4, wherein the sensingelectrode part comprises a first bridge connecting adjacent first touchelectrodes, among the first touch electrodes, and a second bridgeconnecting adjacent second touch electrodes, among the second touchelectrodes.
 6. The touch sensor of claim 5, wherein the insulating layercomprises a first sub insulating layer and a second sub insulatinglayer, which are sequentially disposed on the first touch electrodes andthe second touch electrodes, and one of the first bridge and the secondbridge is disposed on the first sub insulating layer.
 7. The touchsensor of claim 1, further comprising: a substrate disposed on anexternal side of the support layer.
 8. The touch sensor of claim 7,wherein the substrate is one of a display panel, a polarizing layer, anda window.
 9. The touch sensor of claim 1, wherein a number of trenchesis two or more.
 10. The touch sensor of claim 1, further comprising: aprotection film disposed on the insulating layer.
 11. The touch sensorof claim 1, wherein the trench comprises an air path configured to allowa gas to externally discharge from the trench.
 12. A display device,comprising: a display panel; and a touch sensor disposed on an uppersurface of the display panel, wherein the touch sensor comprises: asupport layer comprising a touch area and a non-touch area surroundingthe touch area; a sensing electrode part disposed on one side of thesupport layer in the touch area; and an insulating layer disposed on theone side of the support layer in the touch area and in a portion of thenon-touch area, and wherein the insulating layer has a trench disposedalong a perimeter of the touch area in the non-touch area to fullysurround the touch area, wherein the insulating layer comprises a firstinsulating part disposed in the touch area and in a portion of thenon-touch area that is directly adjacent to the touch area, and a secondinsulating part disposed along a perimeter of the first insulating partin the non-touch area with the trench interposed therebetween, whereinthe one side of the support layer is exposed in the trench, and whereinthe second insulating part has one or more air paths connected to thetrench.
 13. The display device of claim 12, wherein the display paneland the support layer are bonded to each other with an adhesiveinterposed between the display panel and the support layer.
 14. Thedisplay device of claim 12, further comprising: a window provided on thetouch sensor, wherein the support layer and any one of the window andthe display panel are bonded to each other with an adhesive interposedtherebetween.
 15. The display device of claim 12, further comprising: awindow disposed on the display panel, and a polarizing layer disposedbetween the display panel and the window, wherein the touch sensor isdisposed between the window and the polarizing layer or between thepolarizing layer and the display panel.
 16. The display device of claim15, wherein the support layer and at least one of the window, thepolarizing layer, and the display panel are bonded to each other with anadhesive interposed therebetween.
 17. A method of manufacturing a touchsensor, comprising: forming a support layer on a carrier substrate;forming a touch electrode pattern on one side of the support layer;forming the touch sensor by forming an insulating layer on the touchelectrode pattern; separating the touch sensor from the carriersubstrate; and attaching the touch sensor onto a substrate, wherein theinsulating layer is formed in a touch area and a non-touch areasurrounding the touch area, and the insulating layer has a trenchdisposed along a perimeter of the touch area in the non-touch area tofully surround the touch area, wherein the insulating layer comprises afirst insulating part disposed in the touch area and in a portion of thenon-touch area that is directly adjacent to the touch area, and a secondinsulating part disposed along a perimeter of the first insulating partin the non-touch area with the trench interposed therebetween, whereinthe one side of the support layer is exposed in the trench, and whereinthe first insulating part is not interposed between the support layerand the sensing electrode part.
 18. The method of claim 17, wherein theattaching of the touch sensor onto the substrate is performed by aroll-to-roll method.